IPB031N08N5ATMA1 Allicdata Electronics
Allicdata Part #:

IPB031N08N5ATMA1TR-ND

Manufacturer Part#:

IPB031N08N5ATMA1

Price: $ 3.80
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 80V TO263-3N-Channel 80V 120A (Tc) 167...
More Detail: N/A
DataSheet: IPB031N08N5ATMA1 datasheetIPB031N08N5ATMA1 Datasheet/PDF
Quantity: 8000
1000 +: $ 3.00000
Stock 8000Can Ship Immediately
$ 3.8
Specifications
Series: OptiMOS™
Packaging: Tape & Reel (TR) 
Part Status: Active
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Rds On (Max) @ Id, Vgs: 3.1 mOhm @ 100A, 10V
Vgs(th) (Max) @ Id: 3.8V @ 108µA
Power - Max: --
Gate Charge (Qg) (Max) @ Vgs: 87nC @ 10V
Vgs (Max): ±20V
Input Capacitance (Ciss) (Max) @ Vds: 6240pF @ 40V
FET Feature: --
Power Dissipation (Max): 167W (Tc)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D²PAK (TO-263AB)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Base Part Number: --
Description

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The IPB031N08N5ATMA1 is a type of N-channel Enhancement Mode Field Effect Transistor (FET) designed for low voltage and high speed applications. It is a type of single enhancement-mode MOSFET, which has a N-type semiconductor channel and the current flows through the channel when a gate voltage is applied. The IPB031N08N5ATMA1 FET is an ideal choice for low voltage switching applications, such as low voltage gate drive, motor controllers, and other low voltage switching applications.

Construction

The IPB031N08N5ATMA1 FET is constructed using a single layer of N-type silicon material on a substrate. The silicon material is surrounded by a gate oxide layer on the surface and a source/drain region connected to the silicon layer. A metal gate is placed on top of the gate oxide layer, and a source/drain diffusion layer is connected to the source/drain region. A protective layer is placed on top of the structure to provide electrical isolation from the environment.

Operation and Working Principle

The IPB031N08N5ATMA1 FET operates on the principal of the MOSFET. This device works by applying an electric field through a gate oxide layer to modify the properties of the N-type silicon. When a negative voltage is applied to the gate, the negative charge induced into the N-type layer creates an inversion layer at the surface of the silicon material. This inversion layer changes the conductivity of the material, and causes the current to flow through the channel.

The IPB031N08N5ATMA1 is a voltage-controlled device, meaning that the gate voltage (Vgs) controls the flow of current through the device. When the gate voltage is negative, the device is “OFF” and no current will flow through the device. Conversely, when the gate voltage is positive, the device will turn “ON” and the current through the FET will be controlled by the gate voltage.

Applications

The IPB031N08N5ATMA1 FET is suitable for a variety of low voltage and high speed applications. It is commonly used for low voltage gate drive applications, such as lighting control and motor controllers. It is also used in power switches and other low voltage switching applications. This device is ideally suited for use in low voltage, high speed applications due to its low RDS (ON) and low gate capacity.

Advantages

The biggest advantage of the IPB031N08N5ATMA1 is that it is a low power, high speed device. It has a very low RDS (ON) which allows for better efficiency in low voltage applications. It also has a low gate capacitance, which results in higher switching speeds. Furthermore, the device has excellent immunity to corrosion, making it a great choice for high humidity environments.

Disadvantages

One of the drawbacks of the IPB031N08N5ATMA1 is that it has a limited current capacity of only 1.8A. This is relatively low compared to other transistors, and can be an issue when using the device in high current applications. Furthermore, the device is relatively sensitive to thermal stress, and can be damaged in extreme temperatures.

The specific data is subject to PDF, and the above content is for reference

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