IXFC52N30P Allicdata Electronics
Allicdata Part #:

IXFC52N30P-ND

Manufacturer Part#:

IXFC52N30P

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: MOSFET N-CH 300V 24A ISOPLUS220
More Detail: N-Channel 300V 24A (Tc) 100W (Tc) Through Hole ISO...
DataSheet: IXFC52N30P datasheetIXFC52N30P Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Vgs(th) (Max) @ Id: 5V @ 4mA
Package / Case: ISOPLUS220™
Supplier Device Package: ISOPLUS220™
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 100W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 3490pF @ 25V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 110nC @ 10V
Series: PolarHT™ HiPerFET™
Rds On (Max) @ Id, Vgs: 75 mOhm @ 26A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 24A (Tc)
Drain to Source Voltage (Vdss): 300V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Obsolete
Packaging: Tube 
Description

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A IXFC52N30P, or an insulated gate field effect transistor (IGFET) is a type of transistor that is widely used in power electronics applications, especially in high power and sophisticated electronic devices. Its main function is to switch electronic current on and off, making it perfect for use in power-control circuitry. This type of device is actually a specialized MOSFET with thick gate oxide, designed to withstand higher voltages. Its specifications provide a great deal of flexibility in its usage. Its low drain-source forward voltage drop (vds) and low gate threshold voltage (vth) means it can be used as an efficient switch in a variety of circuits.

The IXFC52N30P is a power NMOS field effect transistor (FET) built on N-Channel MOSFET technology. It is specifically designed for applications that require low gate charge and low on-state resistance (RDS(ON)). It has a drain-source breakdown voltage (BVDSS) of 52V, gate-source voltage (Vgs) of -20V to 20V, and on resistance (RDS(ON)) of 0.45 ohms. It can handle power dissipation up to 1080W at junction-to-ambient temperature of 150 degrees C. It is also capable of providing high levels of performance in switching applications, with its high-speed switching capabilities due to the FETs\' wide range of Vds drain-source voltage ratings. This FETs is also designed with Gate protection, making it more robust in short-circuit overload conditions.

The IXFC52N30P FET works by allowing the gate voltage to control the current flow between the source and drain terminals. It is composed of a gate oxide layer and a gate electrode, which controls the current flow. When the gate oxidide layer is applied with a negative gate-source voltage (Vgs), it creates an electric field in the oxide layer which attracts electrons from the source terminal and drains them at the drain terminal. This creates an inversion layer of charge carriers between the two terminals which allows current to flow. In addition, the gate oxide layer itself is insulated, making it possible to create a high insulation region between the source and the drain.

In terms of its application field, the IXFC52N30P FET has recently been used in power converters, automotive electronic systems, and EMI sensitive applications. It has also been used in power conditioning circuits, and as a switch in motor controllers and Uninterruptible Power Supply (UPS) systems. It can be used for low-side voltage regulation, motor control and energy recovery, as well as for high power battery charging applications. Its high performance and robust design make it a great choice for high-voltage applications, such as those in computers, telecom, power tools and LED lighting, among others.

Overall, the IXFC52N30P FET is a highly efficient, easy to use component for a wide variety of applications. Its superior performance and flexibility makes it suitable for a range of high-powered and complex electronic devices. Its low drain-source forward voltage drop and low gate threshold voltage make it especially beneficial in circuits which require high switching speeds and efficiencies. Its high power dissipation capabilities, combined with its gate protection, makes it a great choice in many high-power and high reliability applications.

The specific data is subject to PDF, and the above content is for reference

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