IRF8113 Allicdata Electronics
Allicdata Part #:

IRF8113-ND

Manufacturer Part#:

IRF8113

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 30V 17.2A 8-SOIC
More Detail: N-Channel 30V 17.2A (Ta) 2.5W (Ta) Surface Mount 8...
DataSheet: IRF8113 datasheetIRF8113 Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 2.5W (Ta)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 2910pF @ 15V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 36nC @ 4.5V
Series: HEXFET®
Rds On (Max) @ Id, Vgs: 5.6 mOhm @ 17.2A, 10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Current - Continuous Drain (Id) @ 25°C: 17.2A (Ta)
Drain to Source Voltage (Vdss): 30V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Obsolete
Packaging: Tube 
Description

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The IRF8113 is a single insulated gate field-effect transistor (IGFET) designed for use in a wide variety of high current switching and linear applications. This device features an enhanced substrate channel design, an extremely low on-state resistance, a fast increase of current capability, and excellent temperature and frequency stability. The IRF8113 is a low-cost, high-performance solution for any application where a low on-state resistance is required.

Typical Applications

  • High speed power switching circuits
  • DC-DC converters
  • Switch mode power supplies
  • Motor drives
  • Load switches
  • Level/tuned amplifiers
  • Crossover circuits
  • White goods testing

Device Structure and Working Principle

The IRF8113 is made from two different types of FETs. The source and drain regions are formed from a N-channel FET and the gate region is made from a P-channel FET. This combination of FETs is sometimes referred to as a “heterojunction”. The N-channel FET is responsible for conducting current between the source and drain, while the P-channel FET is responsible for controlling the current between the source and drain. The P-channel FET acts as an insulator, when the gate voltage is low and allows current to flow through the N-channel FET when the gate voltage is high.

In operation, the gate voltage is used to control the current through the device. When the gate voltage is low, the FET is off and no current is allowed to flow through the N-channel. As the gate voltage is increased, the FET begins to conduct and a current is allowed to flow through the N-channel. The amount of current that can flow through the N-channel is determined by the gate voltage and how close the two FETs are together.

The IRF8113 also features a special substrate channel which allows the device to be used at high speed by eliminating resistance and increasing the switching speed. This substrate channel also helps to protect the device from high voltage spikes, which can cause damage to the FET.

Conclusion

The IRF8113 is an excellent choice for any application that requires a low on-state resistance and a high switching speed. The combination of a heterojunction FET design and a substrate channel make it an ideal choice for those applications. Furthermore, the fast rise of current capability and excellent temperature and frequency stability provide reliable performance in a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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