BSZ088N03MSGATMA1 Allicdata Electronics
Allicdata Part #:

BSZ088N03MSGATMA1TR-ND

Manufacturer Part#:

BSZ088N03MSGATMA1

Price: $ 0.23
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 30V 40A TSDSON-8
More Detail: N-Channel 30V 11A (Ta), 40A (Tc) 2.1W (Ta), 35W (T...
DataSheet: BSZ088N03MSGATMA1 datasheetBSZ088N03MSGATMA1 Datasheet/PDF
Quantity: 5000
5000 +: $ 0.21469
Stock 5000Can Ship Immediately
$ 0.23
Specifications
Vgs(th) (Max) @ Id: 2V @ 250µA
Package / Case: 8-PowerTDFN
Supplier Device Package: PG-TSDSON-8
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 2.1W (Ta), 35W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 2100pF @ 15V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 27nC @ 10V
Series: OptiMOS™
Rds On (Max) @ Id, Vgs: 8 mOhm @ 20A, 10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 40A (Tc)
Drain to Source Voltage (Vdss): 30V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tape & Reel (TR) 
Description

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BSZ088N03MSGATMA1 is a high-density N-channel MOSFET that is widely used in a variety of applications. It is a single perichip MOSFET that has an operating temperature range from -55°C to 150°C. The BSZ088N03MSGATMA1 has a drain-source voltage rating of 28V and a maximum current rating of 10A. This high-density MOSFET is designed for applications that require high-power switching and high current in a small package.

The BSZ088N03MSGATMA1 has an on-resistance of 0.088Ω. This device is capable of providing low resistance and high switching capability with a very small gate charge. It also has a maximum operating temperature of 150°C which makes it suitable for high-temperature applications. The BSZ088N03MSGATMA1 is also RoHS compliant.

The working principle of the BSZ088N03MSGATMA1 is based on the physical properties of a metal-oxide-semiconductor field-effect transistor (MOSFET). The MOSFET is an electronic component that exhibits rectifying characteristics by controlling the current flow through an electric field. The device is composed of an insulated-gate field-effect transistor (IGFET) and an insulated-gate bipolar transistor (IGBT). The IGFET forms the gate portion of the MOSFET. The IGBT forms the body portion of the MOSFET.

The IGFET is composed of a P-Doped substrate and an N-Doped channel. The channel is formed by a PN junction between the P-type substrate and the N-type channel. The P-type substrate acts as the gate of the MOSFET, while the N-type channel acts as the drain and source of the MOSFET. A voltage applied to the gate of the MOSFET modulates the current flow through the N-type channel, allowing the user to control the current flow.

The IGBT is composed of two PN junctions. The first junction is formed between the source and the gate, while the second junction is formed between the drain and the substrate. The IGBT amplifies the signal applied to the gate to create a higher drain-source voltage, making the IGBT more suitable for high-power switching applications. The IGBT also has a lower on-resistance than the IGFET, allowing for higher current ratings.

The key advantage of the BSZ088N03MSGATMA1 is its high-density design. This single perichip MOSFET is capable of handling high-current loads in a very small package. The MOSFET is also capable of providing low on-resistance and high switching capability with a very small gate charge. The high-temperature rating of the device also makes it suitable for high-temperature applications. The BSZ088N03MSGATMA1 is ideal for applications that require high-power switching and high current in a small package.

The specific data is subject to PDF, and the above content is for reference

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