Allicdata Part #: | FDS4470FSTR-ND |
Manufacturer Part#: |
FDS4470 |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | ON Semiconductor |
Short Description: | MOSFET N-CH 40V 12.5A 8SOIC |
More Detail: | N-Channel 40V 12.5A (Ta) 2.5W (Ta) Surface Mount 8... |
DataSheet: | FDS4470 Datasheet/PDF |
Quantity: | 5000 |
Vgs(th) (Max) @ Id: | 5V @ 250µA |
Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package: | 8-SO |
Mounting Type: | Surface Mount |
Operating Temperature: | -55°C ~ 175°C (TJ) |
Power Dissipation (Max): | 2.5W (Ta) |
FET Feature: | -- |
Input Capacitance (Ciss) (Max) @ Vds: | 2659pF @ 20V |
Vgs (Max): | +30V, -20V |
Gate Charge (Qg) (Max) @ Vgs: | 63nC @ 10V |
Series: | PowerTrench® |
Rds On (Max) @ Id, Vgs: | 9 mOhm @ 12.5A, 10V |
Drive Voltage (Max Rds On, Min Rds On): | 10V |
Current - Continuous Drain (Id) @ 25°C: | 12.5A (Ta) |
Drain to Source Voltage (Vdss): | 40V |
Technology: | MOSFET (Metal Oxide) |
FET Type: | N-Channel |
Part Status: | Active |
Packaging: | Tape & Reel (TR) |
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The FDS4470 is a type of single N-channel enhancement mode field effect transistor (FET). As with all FETs, the FDS4470 is a voltage-controlled device which uses an applied voltage to control the flow of electric current. In the FDS4470, the current is controlled by the gate-source voltage, with the source being the input and the drain being the output. The FDS4470 requires a minimum gate-to-source voltage of -3V in order to maintain full on-state current.
The FDS4470 is typically used in electronic circuits as an electronic switch, due to its low on-resistance. This low resistance makes it an ideal switch for high-speed switching applications such as power switching circuits, as well as high frequency switching in radio frequency (RF) systems. It is also commonly used in switching power supplies, on/off controllers and voltage regulators. The FDS4470 is also used in various industrial and automotive applications, particularly in the switching of loads with heavy current demands.
The FDS4470 is also widely used in automotive electronics, both as a driver for sensors and as a switch for power safety systems. It is also commonly used in low- and mid-power motor control circuits, where it provides fast and efficient switching and motor speed regulation capabilities. Further, the FDS4470 can also be used to control DC motors and AC inductive loads, allowing for more precise and efficient control of motor speed and current.
The FDS4470 requires very low gate-source voltage and minimal voltage threshold in order to operate, making it an ideal solution for applications that require the switch to be activated quickly and without a great deal of power. In addition, the low on-resistance of the FDS4470 allows for low power operation and higher efficiency, making it an ideal choice for applications where power efficiency is a primary concern.
The FDS4470 is constructed using a fabrication process called CMOS, or Complementary Metal Oxide Semiconductor. This process uses a combination of metal layers, typically silicon dioxide and silicon nitride, to form the FET\'s structure. In a CMOS process, a conductive metal gate layer is applied over the source and drain, allowing the device to be switched on and off by controlling the voltage applied to the gate. This process is highly efficient, allowing for better performance from the FET, as well as allowing for greater device density.
The FDS4470 also features a fast switching speed, which means that the FET can respond to changes in the applied gate voltage quickly. This makes the FDS4470 ideal for use in high-speed switching applications, such as RF systems, where speed and accuracy are essential. The FDS4470 is also robust and reliable, with a low failure rate and excellent heat dissipation properties.
In summary, the FDS4470 is a versatile and reliable single N-channel enhancement mode Field Effect Transistor. It is an excellent choice for high-speed applications, including RF systems, power switching, and automotive Electronics, where fast switching and low power are needed. Its fabrication process allows for higher device density and lower on-resistance, while its robust design ensures reliable operation and excellent heat dissipation.
The specific data is subject to PDF, and the above content is for reference
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