IPD50R399CP Allicdata Electronics
Allicdata Part #:

IPD50R399CP-ND

Manufacturer Part#:

IPD50R399CP

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 550V 9A TO-252
More Detail: N-Channel 550V 9A (Tc) 83W (Tc) Surface Mount PG-T...
DataSheet: IPD50R399CP datasheetIPD50R399CP Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Vgs(th) (Max) @ Id: 3.5V @ 330µA
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Supplier Device Package: PG-TO252-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 83W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 890pF @ 100V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 23nC @ 10V
Series: CoolMOS™
Rds On (Max) @ Id, Vgs: 399 mOhm @ 4.9A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 9A (Tc)
Drain to Source Voltage (Vdss): 550V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Obsolete
Packaging: Tape & Reel (TR) 
Description

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The IPD50R399CP is a single N-channel Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) featuring high breakdown voltage, high switch-off drain current and a low gate charge. The IPD50R399CP is used in a wide range of applications such as diodes, chips, IGBTs, H-bridges, hybrid circuits, and medical and industrial drives. Its wide range of uses and capabilities make it an extremely versatile component of many complex electronics systems.

One example of where the IPD50R399CP is often used is in the power management of electronic components, especially those which require high switching frequencies and/or large amounts of power. As such, it is commonly applied to the motor drives of industrial robots and other machinery since these require fast switching for their power management. In addition, it can also be used in the power management of refrigeration systems, air conditioning units and uninterruptible power supplies.

The IPD50R399CP also features a number of features which make it suitable for these applications. Firstly, its built-in voltage protection keeps components from exceeding a predetermined voltage range. Secondly, its thermal characteristics protect components from excessive temperatures. Finally, its high drain-source breakdown voltage enables it to continuously sustain higher voltages. As such, the IPD50R399CP provides efficient operation, long life cycles and reliable power management.

The IPD50R399CP’s working principle involves a thin layer of insulated Gate Polysilicon that is placed between a source and drain formed within a substrate. The Gate Polysilicon is responsible for creating an electric field in order to control the current flow between the source and drain. When a voltage is applied to the Gate Polysilicon, an inversion layer is formed which allows the current to flow. When the voltage is removed, the inversion layer dissipates and the flow of current stops.

The IPD50R399CP features an isolated gate placed between two electrodes which allow for high-voltage commands, which allows for more precise operations. In addition, the IPD50R399CP’s high-frequency capabilities make it suitable for applications that require fast switching. Furthermore, its high breakdown voltage protects the Gate Polysilicon from overvoltage applications.

The MOSFET’s low on-resistance also allows for high power savings, meaning more efficient systems, as well as faster switching times. This makes the IPD50R399CP ideal for applications that require both high performance, and efficient power management. As such, the IPD50R399CP finds widespread use in applications such as medical equipment, consumer electronics, motors, H-bridges, switches, and other consumer electronic devices.

In summary, the IPD50R399CP is a single N-channel Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) featuring high breakdown voltage, high switch-off drain current, and a low gate charge. It is used in a wide variety of applications for its versatile capabilities and short switching times. Its working principle involves a thin layer of insulated Gate Polysilicon that is placed between a source and drain formed within a substrate. When a voltage is applied to the Gate Polysilicon, an inversion layer is formed which allows the current to flow. The IPD50R399CP is ideal for applications requiring both high performance and efficient power management.

The specific data is subject to PDF, and the above content is for reference

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