IXTH32N65X Allicdata Electronics
Allicdata Part #:

IXTH32N65X-ND

Manufacturer Part#:

IXTH32N65X

Price: $ 4.02
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: MOSFET N-CH 650V 32A TO-247
More Detail: N-Channel 650V 32A (Tc) 500W (Tc) Through Hole TO-...
DataSheet: IXTH32N65X datasheetIXTH32N65X Datasheet/PDF
Quantity: 1000
60 +: $ 3.61893
Stock 1000Can Ship Immediately
$ 4.02
Specifications
Vgs(th) (Max) @ Id: 5.5V @ 250µA
Package / Case: TO-247-3
Supplier Device Package: TO-247 (IXTH)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 500W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 2205pF @ 25V
Vgs (Max): ±30V
Gate Charge (Qg) (Max) @ Vgs: 54nC @ 10V
Series: --
Rds On (Max) @ Id, Vgs: 135 mOhm @ 16A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 32A (Tc)
Drain to Source Voltage (Vdss): 650V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tube 
Description

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The IXTH32N65X is a type of insulated-gate bipolar transistor, also known as an IGBT for short. It combines the features of both a field-effect transistor (FET) and a bipolar junction transistor (BJT). The IXTH32N65X is part of the family of products from IXYS Corporation, a U.S.-based company which specializes in the manufacture of power semiconductors for energy savings and clean energy solutions.

The IXTH32N65X transistors are designed to switch at a high frequency with low losses, and can be used in a wide range of applications such as motor control, solar inverters, renewable energy storage systems, and other power electronic applications. They are often used in applications where space is limited, and where reverse recovery time and dynamic losses must be minimized.

The IXTH32N65X has a rated voltage of 650V, and its maximum junction temperature is 175°C. It has a rated drain current of up to 32A at 25°C, and a maximum drain-source on-state resistance of just 8.5 mΩ. Its maximum gate-source voltage is ±10V, and its maximum gate-drain voltage is ±25V. The IXTH32N65X has a maximum power dissipation of 1000W, and a drain-source breakdown voltage of 800V.

The IXTH32N65X is a single-package, surface-mount device which can be easily integrated into a variety of applications. It is easy to configure, and has built-in under-voltage protection as well as over temperature and over current protection. It also features a variety of convenient features such as EMI filters, fast switching, and a low on-state voltage drop.

The working principle of an IGBT is the same as that of a power MOSFET; both use an insulated-gate to control the switching of the device. The difference between the two is that an IGBT has a much faster switching speed, and a higher voltage rating than a MOSFET. In an IGBT, the input voltage is applied to the gate, and an electric field is generated between it and the PN junction. This electric field between the PN junction and the gate causes the junction to turn on or off depending on the direction of the input voltage. The IXTH32N65X transistor is designed to produce low reverse recovery times, meaning that it can switch quickly and efficiently with minimal power losses.

The IXTH32N65X is an ideal choice for applications in which high voltage and high current, along with fast switching capabilities, are required. It is an excellent choice for motor drives, solar inverters, DC/AC converters, and other power electronic applications. It can also be used in other applications where low voltage drop, low switching losses and high current operation are needed.

The specific data is subject to PDF, and the above content is for reference

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