SI7611DN-T1-GE3

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1. Description

The basic index to measure the thermal performance of a device is the junction-to-case thermal resistance Rθjc or the junction-to-foot thermal resistance Rθjf. This parameter measures the device receiver installed under unlimited heat, so it is a characteristic of the device In other words, it has nothing to do with the object on which the attribute device is installed. Comparing PowerPAK 1212-8 and PowerPAK SO-8, the standard TSSOP-8 and SO-8 have the same steady-state performance. By minimizing the thermal resistance from junction to pin, the MOSFET die temperature is very close to that of the PC board. Consider installing a PC board with a board temperature of 45°C on four devices. Assume that the power consumption of each device is 2W. Using the thermal resistance characteristics of the junction pins of the device PowerPAK 1212-8 and other SMT packages, it is determined that the temperature of the PowerPAK 1212-8 die is 49.8°C, the temperature of the standard SO-8 is 85°C, and the temperature of the standard SO-8 is 149°C , Standard TSSOP-8 and TSOP-6 are 125°C. This is a PowerPAK 1212-8 circuit board with a temperature rise of 4.8°C, and the temperature rise of other SMT packages exceeds 40°C. A rise of 4.8 °C has the least impact on rDS(ON), while the rise Exceeding 40 °C can cause rDS(ON) to increase by up to 20%.

2. PRODUCT SUMMARY

3. Feature

    1. TrenchFET® Power MOSFET

    2. Low thermal resistance PowerPAK® package with small size and 1.07 mm thin profile

    3. 100% Rg and UIS test

4. Application

    1. Load switch

5. PRODUCT SUMMARY