IRF610SPBF Allicdata Electronics
Allicdata Part #:

IRF610SPBF-ND

Manufacturer Part#:

IRF610SPBF

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Vishay Siliconix
Short Description: MOSFET N-CH 200V 3.3A D2PAK
More Detail: N-Channel 200V 3.3A (Tc) 3W (Ta), 36W (Tc) Surface...
DataSheet: IRF610SPBF datasheetIRF610SPBF Datasheet/PDF
Quantity: 635
Stock 635Can Ship Immediately
Specifications
Vgs(th) (Max) @ Id: 4V @ 250µA
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Supplier Device Package: D2PAK
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 3W (Ta), 36W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 140pF @ 25V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 8.2nC @ 10V
Series: --
Rds On (Max) @ Id, Vgs: 1.5 Ohm @ 2A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 3.3A (Tc)
Drain to Source Voltage (Vdss): 200V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tube 
Description

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IRF610SPBF is an advanced power metal-oxide-semiconductor field-effect transistor (MOSFET) designed and developed by International Rectifier Corporation with an internal structure similar to an insulated-gate-bipolar transistor. It features low gate charge, low on-resistance and excellent switching speed, making it an ideal choice for applications requiring high efficiency, high voltage and low switching frequency.

Application Field

IRF610SPBF is used in a wide variety of applications, including switching power converters, motor drives, high voltage, high frequency DC-DC converters, switching regulators and class D audio amplifiers. It can also be used as a gate driver for high current applications requiring low gate charge and low gate voltage.

Working Principle

IRF610SPBF works based on the principle of insulated-gate field-effect transistors (IGFETs). It consists of a metal-oxide-semiconductor (MOS) layer, which acts as the gate, a semiconductor substrate and source and drain contacts. The gate is separated from the semiconductor substrate by a thin insulating layer. When a positive voltage is applied to the gate, it attracts positive charge carriers (holes) and negative charge carriers (electrons) to the MOS layer and forms an inversion layer between the MOS layer and the substrate. This inversion layer reduces the resistance between the source and drain contacts, thereby allowing current flow. Conversely, when a negative voltage is applied to the gate, the inversion layer is broken and the resistance between the source and drain contacts increases, thus reducing the current flow.

IRF610SPBF also utilizes an advanced insulation/filter structure to improve its switching speed, temperature range, and reliability. This advanced insulation/filter structure includes a diffusion path between the semiconductor substrate and the gate and a high-precision passivation layer. The diffusion path isolates the gate from the semiconductor substrate, reducing the overall leakage current. The high-precision passivation layer further decreases the surface energy of the gate and decreases the amount of trapped charges in the gate oxide.

Conclusion

IRF610SPBF is an advanced power MOSFET device that is ideal for high efficiency, high voltage, and low switching frequency applications. It utilizes an insulated-gate field-effect transistor structure, an advanced insulation/filter structure, and a high-precision passivation layer for superior performance. It is widely used in a variety of power converter designs for switching power converters, motor drives, high voltage, high frequency DC-DC converters, switching regulators and class D audio amplifiers.

The specific data is subject to PDF, and the above content is for reference

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