IXFP110N15T2 Allicdata Electronics
Allicdata Part #:

IXFP110N15T2-ND

Manufacturer Part#:

IXFP110N15T2

Price: $ 2.32
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: MOSFET N-CH 150V 110A TO-220
More Detail: N-Channel 150V 110A (Tc) 480W (Tc) Through Hole TO...
DataSheet: IXFP110N15T2 datasheetIXFP110N15T2 Datasheet/PDF
Quantity: 1000
1 +: $ 2.32000
10 +: $ 2.25040
100 +: $ 2.20400
1000 +: $ 2.15760
10000 +: $ 2.08800
Stock 1000Can Ship Immediately
$ 2.32
Specifications
Vgs(th) (Max) @ Id: 4.5V @ 250µA
Package / Case: TO-220-3
Supplier Device Package: TO-220AB
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Power Dissipation (Max): 480W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 8600pF @ 25V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Series: GigaMOS™, HiPerFET™, TrenchT2™
Rds On (Max) @ Id, Vgs: 13 mOhm @ 55A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 110A (Tc)
Drain to Source Voltage (Vdss): 150V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tube 
Description

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The IXFP110N15T2 is a N-channel enhancement mode Field Effect Transistor (FET). This device is intended for use as a switching device in general purpose applications such as low–side switching configurations or in for special purpose applications such as pre–bias or level shift applications. It is available in a single, dual and triple die configuration.

The IXFP110N15T2 has an advanced ultra-thin profile package that is ideal for high-density switching applications such as servers and datacom equipment where high-current density and maximum power is required. The device has a maximum on-state resistance of 110Ω, so it can handle high currents without heating up. The thermal resistance junction to lead is 0.167°C/W ensuring that heat is dissipated evenly.

The IXFP110N15T2 is an insulated gate field effect transistor. It uses an insulated gate to control the movement of electrons between the source and drain. When a positive gate voltage is applied to the device, electrons are drawn from the source through the gate to the drain. This creates a low resistance between the source and the drain, allowing current to flow through the device and allowing the device to turn on. When a negative gate voltage is applied, the electrons are repelled from the gate and the resistance between the source and drain increases, turning the device off.

The IXFP110N15T2 has a low turn-on voltage, approximately 2.5V, meaning that the device can be used in both low voltage and high voltage applications. It has a low gate to drain capacitance, allowing for fast switching times. The device also has a low input capacitance, which ensures that high frequencies can be used without sacrificing switching speed.

The IXFP110N15T2 is ideal for a wide range of applications, including switching, level shifting, and pre-bias applications. Due to its low on-state resistance, high current carrying capacity, and low thermal resistance, it can be used in high-performance switching applications such as servers and datacom equipment. It can also be used in specialized applications such as low-side switching and level shifting. Additionally, the IXFP110N15T2 works best at medium to high frequencies, making it ideal for applications that require high switching speed or high switching frequencies.

In summary, the IXFP110N15T2 is a N-channel enhancement mode FET, ideal for high-density switching applications. It contains an insulated gate to control the flow of electrons between the source and drain, and has a turn-on voltage of 2.5V. Its low on-state resistance, high current carrying capacity, and low thermal resistance make it suitable for high performance switching applications. Additionally, the IXFP110N15T2 works best at medium to high frequencies, making it ideal for applications that require high switching speed or high switching frequencies.

The specific data is subject to PDF, and the above content is for reference

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