FDMS86101DC Allicdata Electronics
Allicdata Part #:

FDMS86101DCTR-ND

Manufacturer Part#:

FDMS86101DC

Price: $ 0.43
Product Category:

Discrete Semiconductor Products

Manufacturer: ON Semiconductor
Short Description: MOSFET N-CH 100V 14.5A 8-PQFN
More Detail: N-Channel 100V 14.5A (Ta), 60A (Tc) 3.2W (Ta), 125...
DataSheet: FDMS86101DC datasheetFDMS86101DC Datasheet/PDF
Quantity: 1000
1 +: $ 0.43200
10 +: $ 0.41904
100 +: $ 0.41040
1000 +: $ 0.40176
10000 +: $ 0.38880
Stock 1000Can Ship Immediately
$ 0.43
Specifications
Vgs(th) (Max) @ Id: 4V @ 250µA
Package / Case: 8-PowerTDFN
Supplier Device Package: Dual Cool™56
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 3.2W (Ta), 125W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 3135pF @ 50V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 44nC @ 10V
Series: Dual Cool™, PowerTrench®
Rds On (Max) @ Id, Vgs: 7.5 mOhm @ 14.5A, 10V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Current - Continuous Drain (Id) @ 25°C: 14.5A (Ta), 60A (Tc)
Drain to Source Voltage (Vdss): 100V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tape & Reel (TR) 
Description

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The FDMS86101DC is a semiconductor device belonging to a variety of FETs and MOSFETs known as single-gate field-effect transistors or SGFETs. The FDMS86101DC exhibits superior performance as compared to conventional MOSFETs, making it an ideal choice for applications ranging from motor control to AC/DC and power conversion.

The FDMS86101DC is a N-channel enhancement mode device, meaning that when the gate voltage is held at a high logic level, the device can turn on the circuit. Conversely, when the gate voltage is held at a low logic level, the FDMS86101DC will remain off. The quality of the device can be seen in its ability to accept low gate voltages of 1.8V and will only require a total gate charge of 4.8nC. This ensures that the device will remain stable even with fluctuations in the gate voltage.

The embodiment in the form of the FDMS86101DC is integrally backed by a design-specific architecture that caters the needs of various applications, particularly for those requiring highly efficient power delivery. It can support a maximum drain-source voltage of 100 V and drive currents of up to 11 A. The VDSS is also designed to remain relatively constant over the temperature range, ensuring that the device can maintain optimum performance levels at all times.

From a physical point of view, the FDMS86101DC consists of a dielectric isolation shield and an interconnect layer. The dielectric isolation shield, which is a combination of a series of thin films of silica, acts as a barrier to protect the device from electrical noise and interference. The interconnect layer contains several of the critical components that provide the n-channel and p-channel junctions.

The FDMS86101DC enjoys superior benefits in terms of its power efficiency, owing to its design-specific architecture. The gate oxide used in the FDMS86101DC offers a level of high breakdown voltage and leakage protection that is unique to this type of device. Additionally, its large temperature temperature range operation allows the device to remain operational over a wide range of temperatures. The FDMS86101DC also employs an advanced gate oxide structure, which is designed to reduce switching times and reduce power consumption.

The FDMS86101DC is an excellent choice for a variety of applications such as circuit motor control, power electronics, rectification, and other power control applications. Its superior design-specific architecture ensures that power dissipated is exactly what is required for the specific application at hand. It also allows for extreme flexibility when it comes to design parameters. From the power source to the load, the FDMS86101DC offers superior performance that is unmatched by other power supply solutions.

In conclusion, the FDMS86101DC is a powerful single-gate field-effect transistor that is capable of delivering high-performance power to an application while remaining extremely efficient. Its design-specific architecture ensures that power dissipated is tailored according to the specific requirements of an application. Furthermore, its superior temperature range operation and advanced gate oxide structure make it an ideal choice for sophisticated power electronics and circuit motor control applications.

The specific data is subject to PDF, and the above content is for reference

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