Allicdata Part #: | NTMSD2P102LR2GOS-ND |
Manufacturer Part#: |
NTMSD2P102LR2G |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | ON Semiconductor |
Short Description: | MOSFET P-CH 20V 2.3A 8-SOIC |
More Detail: | P-Channel 20V 2.3A (Ta) 710mW (Ta) Surface Mount 8... |
DataSheet: | NTMSD2P102LR2G Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Vgs(th) (Max) @ Id: | 1.5V @ 250µA |
Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package: | 8-SOIC |
Mounting Type: | Surface Mount |
Operating Temperature: | -55°C ~ 150°C (TJ) |
Power Dissipation (Max): | 710mW (Ta) |
FET Feature: | Schottky Diode (Isolated) |
Input Capacitance (Ciss) (Max) @ Vds: | 750pF @ 16V |
Vgs (Max): | ±10V |
Gate Charge (Qg) (Max) @ Vgs: | 18nC @ 4.5V |
Series: | FETKY™ |
Rds On (Max) @ Id, Vgs: | 90 mOhm @ 2.4A, 4.5V |
Drive Voltage (Max Rds On, Min Rds On): | 2.5V, 4.5V |
Current - Continuous Drain (Id) @ 25°C: | 2.3A (Ta) |
Drain to Source Voltage (Vdss): | 20V |
Technology: | MOSFET (Metal Oxide) |
FET Type: | P-Channel |
Part Status: | Obsolete |
Packaging: | Tape & Reel (TR) |
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The NTMSD2P102LR2G is a single N-Channel, Depleted-Field, Enhancement-Mode Third Generation Vertical-Level Insulated Gate Bipolar Transistor (IGBT). It has been developed to address a full range of applications, from low-frequency switching, to high-frequency switching, and power management for the power electronics industry.
The NTMSD2P102LR2G is a vertical, N-Channel, Depleted-Field, Enhancement-Mode IGBT. It is designed with a versatile, high-frequency field-stop technology, that ensures reliable and low power dissipation operation. This low transition frequency technology preserves the advantages of the vertical field-stop IGBT while increasing its performance capabilities to the demands of modern switching applications.
The NTMSD2P102LR2Ghas a wide range of applications, enabling it to be used in a variety of applications, such as high-efficiency power management, low-ripple transient applications and high-frequency switching. Its low thermal resistance and low, high-frequency transition frequency makes it ideal for in-line, high-efficiency switching applications where thermal and power dissipation are of paramount importance.
The operation of the NTMSD2P102LR2G is based upon a typical IGBT operation, where an insulated gate is used to control the flow of current through the transistor. The gate voltage controls the resistance of the gate-source junction, and this resistance is used to turn the transistor on or off as needed. The gate voltage acts to reduce the forward-voltage of the transistor, which increases the on-state current. The gate voltage also reduces the gate-source capacitance, which decreases switching times, allowing for higher frequency operation.
When on, the insulated gate of the NTMSD2P102LR2G voltage allows electrons to flow freely in the source-gate-drain path, and this creates an electric field between the source and drain. This electric field causes a depletion region, which is the area where no carriers are present. As a result of this electric field, the IGBT exhibits a significantly lower forward on-state resistance than other similar devices.
The NTMSD2P102LR2G IGBT is the optimal choice for high-efficiency power management, low-ripple transient applications and high-frequency switching. Its low thermal resistance and low, high-frequency transition frequency make it a versatile and reliable solution for the power electronics industry. Thanks to its versatile field-stop technology, it offers superior performance, low power dissipation and reliable operation, making it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference
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