SI2341DS-T1-GE3 Allicdata Electronics
Allicdata Part #:

SI2341DS-T1-GE3-ND

Manufacturer Part#:

SI2341DS-T1-GE3

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Vishay Siliconix
Short Description: MOSFET P-CH 30V 2.5A SOT-23
More Detail: P-Channel 30V 2.5A (Ta) 710mW (Ta) Surface Mount S...
DataSheet: SI2341DS-T1-GE3 datasheetSI2341DS-T1-GE3 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Vgs(th) (Max) @ Id: 3V @ 250µA
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SOT-23-3 (TO-236)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 710mW (Ta)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 400pF @ 15V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 15nC @ 10V
Series: TrenchFET®
Rds On (Max) @ Id, Vgs: 72 mOhm @ 2.8A, 10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Current - Continuous Drain (Id) @ 25°C: 2.5A (Ta)
Drain to Source Voltage (Vdss): 30V
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Part Status: Obsolete
Packaging: Tape & Reel (TR) 
Description

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The SI2341DS-T1-GE3 is a current-controlling transistor developed by the semiconductor company, Vishay. It is classified as a single type of field effect transistor (FET), which allows it to be used for a variety of applications. The device has a wide operating temperature range from -55°C to 175°C and can handle voltage up to 60V. It also has a low Rds (on) of 65mΩ making it a great choice for higher power applications.

The SI2341DS-T1-GE3 is used in various applications such as analog switches and amplifiers, power MOSFETs, LED drivers, and driver applications. It is also widely used in power electronics applications due to its low relative temperature coefficient, which reduces the risk of thermal runaway in high power applications.

The working principle of the SI2341DS-T1-GE3 is based on the enhanced vertical N-channel MOSFET (ENFET) design, which makes it suitable for use in high current applications. An ENFET consists of two metal-oxide-semiconductor (MOS) layers which are separated by a thin-oxide layer. The top MOS layer is the source which supplies current to the device, and the bottom MOS layer is the drain which receives the current from the device. A voltage is applied across the gate of the device, which creates an electric field which controls the flow of current across the two MOS layers.

The SI2341DS-T1-GE3 also has a number of other features which make it a great choice for a variety of applications. It has excellent thermal performance, meaning it can handle fast switching times with no need for a heatsink. It also has low gate-threshold voltage and low on-resistance, making it extremely efficient. It also has a low input capacitance and low output capacitance, which reduces the size and cost of the system. And the device has a high breakdown voltage which makes it suitable for high power applications.

Overall, the SI2341DS-T1-GE3 is a great choice for a wide range of applications due to its enhanced vertical N-channel MOSFET design, excellent thermal performance, and low gate-threshold voltage. It is also relatively inexpensive, making it an ideal solution for many applications.

The specific data is subject to PDF, and the above content is for reference

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