Allicdata Part #: | IRF8252TRPBFTR-ND |
Manufacturer Part#: |
IRF8252TRPBF |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Infineon Technologies |
Short Description: | MOSFET N-CH 25V 25A 8-SO |
More Detail: | N-Channel 25V 25A (Ta) 2.5W (Ta) Surface Mount 8-S... |
DataSheet: | IRF8252TRPBF Datasheet/PDF |
Quantity: | 1000 |
Series: | HEXFET® |
Packaging: | Tape & Reel (TR) |
Part Status: | Obsolete |
FET Type: | N-Channel |
Technology: | MOSFET (Metal Oxide) |
Drain to Source Voltage (Vdss): | 25V |
Current - Continuous Drain (Id) @ 25°C: | 25A (Ta) |
Drive Voltage (Max Rds On, Min Rds On): | 4.5V, 10V |
Rds On (Max) @ Id, Vgs: | 2.7 mOhm @ 25A, 10V |
Vgs(th) (Max) @ Id: | 2.35V @ 100µA |
Gate Charge (Qg) (Max) @ Vgs: | 53nC @ 4.5V |
Vgs (Max): | ±20V |
Input Capacitance (Ciss) (Max) @ Vds: | 5305pF @ 13V |
FET Feature: | -- |
Power Dissipation (Max): | 2.5W (Ta) |
Operating Temperature: | -55°C ~ 150°C (TJ) |
Mounting Type: | Surface Mount |
Supplier Device Package: | 8-SO |
Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
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IRF8252TRPBF Application Field and Working Principle
IRF8252TRPBF is a metal-oxide-semiconductor field-effect transistor (MOSFET) manufactured by International Rectifier. It is a vertical denergized metal-oxide-semiconductor (V-DMOS) device, meaning that it has two gate electrodes, one drain electrode, and one source electrode. The V-DMOS structure has two gate electrodes to provide improved switching performance, and the drain and source electrodes help to ensure low on resistance and low output capacitance.
Structure
In this type of MOSFET transistor, the source and drain are placed on the vertical surface of the substrate, while the gate electrodes are placed on the top surface of the substrate. The two gates form a vertical field-effect structure. The vertical field-effect transistor structure can be described as having two thin layers of material that sandwich thin layers of metal. The layers of metal and material act as the electrodes and insulators, respectively. The metal layers are connected to the drain and source electrodes, and the material layers form the electrically insulated vertical gate structure.
Working Principle
The working principle of the IRF8252TRPBF MOSFET can be broken down into three main aspects; gate voltage control, electron depletion, and carrier injection. The gate voltage control allows the user to regulate the amount of current flowing through the MOSFET. By increasing or decreasing the voltage on the gate of the MOSFET, the user can also control the resistivity of the MOSFET. This is because the varying voltages that are applied to the gate electrode cause the electron population on the substrate surface to deplete or increase, thus increasing or decreasing the resistivity of the MOSFET. The second aspect is the electron depletion, which occurs when the gate voltage is increased, leading to a decrease in the number of electrons in the substrate surface. Lastly, the third aspect is the carrier injection mechanism. When the gate voltage is decreased, the number of electrons that are injected from the source into the substrate increases, which increases the resistivity of the MOSFET.
Applications
The IRF8252TRPBF MOSFET has several applications, including use in switching applications. It is commonly used in power management applications such as power supply circuits, motor control, battery management, and consumer electronics. The IRF8252TRPBF is also suitable for use in signal conditioning and power conversion applications due to its low on resistance and low output capacitance. Additionally, the vertical V-DMOS structure of the IRF8252TRPBF allows it to be used in a number of high frequency switching applications and power amplification applications. Furthermore, the IRF8252TRPBF has robust latch as well as avalanche characteristics that make it suitable for use in highly reliable power management applications.
Advantages
The main advantages of the IRF8252TRPBF MOSFET are its high breakdown voltage and its ability to handle large amounts of power. The vertical structure of the V-DMOS MOSFET allows for a larger breakdown voltage than a conventional MOSFET, meaning that the circuit can handle higher voltages and power levels. Additionally, the vertical structure of the MOSFET increases its switching performance, allowing it to switch more quickly and efficiently. The two gate electrode structure also provides improved thermal performance, allowing the device to handle higher temperatures with ease. Lastly, the low on resistance and low output capacitance that are offered with the IRF8252TRPBF also make it an ideal choice for use in power management applications.
Conclusion
Overall, the IRF8252TRPBF MOSFET is a vertical denergized metal-oxide-semiconductor that offers excellent switching performance and has a wide range of applications. It is ideal for use in power management applications, signal conditioning, and power conversion due to its low on resistance and low output capacitance. Additionally, the high breakdown voltage and robust latch and avalanche characteristics ensure that it is suitable for a wide range of applications and can handle large amounts of power.
The specific data is subject to PDF, and the above content is for reference
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