IXTQ32N65X Allicdata Electronics
Allicdata Part #:

IXTQ32N65X-ND

Manufacturer Part#:

IXTQ32N65X

Price: $ 3.70
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: MOSFET N-CH 650V 32A TO-3P
More Detail: N-Channel 650V 32A (Tc) 500W (Tc) Through Hole TO-...
DataSheet: IXTQ32N65X datasheetIXTQ32N65X Datasheet/PDF
Quantity: 1000
60 +: $ 3.32545
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Vgs(th) (Max) @ Id: 5.5V @ 250µA
Package / Case: TO-3P-3, SC-65-3
Supplier Device Package: TO-3P
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 500W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 2205pF @ 25V
Vgs (Max): ±30V
Gate Charge (Qg) (Max) @ Vgs: 54nC @ 10V
Series: --
Rds On (Max) @ Id, Vgs: 135 mOhm @ 16A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 32A (Tc)
Drain to Source Voltage (Vdss): 650V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tube 
Description

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The IXTQ32N65X is a type of field-effect transistor (FET) used in a wide range of electronic applications. It is a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) designed to enable high-speed switching of loads with minimal on-resistance and gate drive power. This makes the IXTQ32N65X a particularly beneficial choice for designing power supplies, converters and inverters in renewable energy applications, such as solar energy systems and other grid applications. The IXTQ32N65X can also be used for radio frequency (RF) applications, as well as for use in video display and baseband applications.

The IXTQ32N65X is a single-channel MOSFET, which means it is built from one FET. It has a typical gate threshold voltage of 3 volts and a typical drain current (ID) from 3 to 17A. The device also features an on-state resistance (RDS(on)) of 32 milliohms at 10V and a breakdown voltage of 650V. One of the benefits of the IXTQ32N65X is its low gate drive power, which reduces overall power dissipation during switching or switching cycles. This can provide substantial advantages when it comes to efficiency, since it eliminates the need for extra power supplies or voltage regulators.

The working principle of the IXTQ32N65X is a direct result of its metal oxide semiconductor construction. At its most basic level, the FET has three terminals: the source, the gate and the drain. When an electric current flows between the source and the drain, the electric field between them creates an electric field in the gate. This electric field is then used to control the flow of current between the source and the drain without any direct contact between them. This is the basis for how power flows through the device, with the amount of current that can be passed determined by the amount of electric field between the drain and the gate.

In the IXTQ32N65X, the gates are specifically optimized for low gate drive power and top gate threshold voltage, ensuring that switching times are minimized and power is conserved. This makes it particularly beneficial for applications that require high-frequency switching and/or that require loads to be switched under low voltage. Additionally, the device’s on-state resistance is designed to stay low even at high drain currents, ensuring less power is lost in heat generation.

The IXTQ32N65X offers many advantages for applications in renewable energy, RF, display and baseband, in addition to other applications that require fast switching and low power consumption. Its low gate drive power ensures efficient operation, while its on-state resistance ensures low power losses during switching. This versatility makes the IXTQ32N65X a highly sought-after device in the electronics industry.

The specific data is subject to PDF, and the above content is for reference

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