SI2302DS,215 Allicdata Electronics
Allicdata Part #:

568-5956-2-ND

Manufacturer Part#:

SI2302DS,215

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: NXP USA Inc
Short Description: MOSFET N-CH 20V 2.5A SOT23
More Detail: N-Channel 20V 2.5A (Tc) 830mW (Tc) Surface Mount T...
DataSheet: SI2302DS,215 datasheetSI2302DS,215 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Vgs(th) (Max) @ Id: 650mV @ 1mA
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Power Dissipation (Max): 830mW (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 10V
Vgs (Max): ±8V
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
Series: TrenchMOS™
Rds On (Max) @ Id, Vgs: 85 mOhm @ 3.6A, 4.5V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.5A (Tc)
Drain to Source Voltage (Vdss): 20V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Obsolete
Packaging: Tape & Reel (TR) 
Description

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The SI2302DS,215 is a single, logic level N-Channel MOSFET (Metal–Oxide–Semiconductor Field-Effect Transistor) designed and manufactured by Vishay Siliconix, a subsidiary of Vishay InterTechnology. This insulated gate FET (Field Effect Transistor) is designed to provide a low on-resistance, low capacitance, and high performance when compared to the conventional power MOSFETs used in power converters. It features a gate voltage of 15 volts (VGS) and a maximum drain source voltage of 200 volts (VDS).

The SI2302DS,215 is ideal for use in various power-conversion applications such as voltage-regulator-modules (VRMs), DC/DC converters, DC/AC inverters, and Class D Audio amplifier stages. It is particularly suitable for applications where a light load and a short switching time is desired. It is also suitable for applications where digital power control is required such as telecommunications, industrial, and automotive applications. In addition, the SI2302DS,215 is also suitable for driving inductive and capacitive loads.

The working principle of the SI2302DS,215 is based on the MOSFET structure. A metal–oxide–semiconductor structure consists of metallic gate electrode placed on an insulator and a silicon substrate. This structure is then connected to a drain and source terminal through the metal contacts. When a positive voltage is applied to the gate terminal, it attracts and traps positively charged carriers in the substrate in the vicinity of the metal–oxide–silicon junction. This creates an inversion layer of electrons at the substrate surface. The electric field between the gate and the source terminals forms a channel through which electrons can move from the source to the drain. The movement of electrons is regulated by the gate voltage, which allows for the switching action of the MOSFET.

The SI2302DS,215 MOSFET combines the advantages of a low on-resistance (RDS(ON)), low capacitance, and high performance. The low on-resistance (RDS(ON)) of the MOSFET allows for a fast switching time and low power losses. The low capacitance has the advantage of low power noise and a minimal switching conductance pulse. The high performance of the MOSFET allows for a higher power density, higher current rating, and more efficient performance.

In conclusion, the SI2302DS,215 is a single, logic level N-Channel MOSFET which can be used for various power-conversion applications. It also combines the advantages of low on-resistance, low capacitance, and high performance. This makes it suitable for applications where a light load, short switching time and digital power control is desired.

The specific data is subject to PDF, and the above content is for reference

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