
Allicdata Part #: | FDS6681ZTR-ND |
Manufacturer Part#: |
FDS6681Z |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | ON Semiconductor |
Short Description: | MOSFET P-CH 30V 20A 8-SO |
More Detail: | P-Channel 30V 20A (Ta) 2.5W (Ta) Surface Mount 8-S... |
DataSheet: | ![]() |
Quantity: | 10000 |
Vgs(th) (Max) @ Id: | 3V @ 250µA |
Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package: | 8-SO |
Mounting Type: | Surface Mount |
Operating Temperature: | -55°C ~ 150°C (TJ) |
Power Dissipation (Max): | 2.5W (Ta) |
FET Feature: | -- |
Input Capacitance (Ciss) (Max) @ Vds: | 7540pF @ 15V |
Vgs (Max): | ±25V |
Gate Charge (Qg) (Max) @ Vgs: | 260nC @ 10V |
Series: | PowerTrench® |
Rds On (Max) @ Id, Vgs: | 4.6 mOhm @ 20A, 10V |
Drive Voltage (Max Rds On, Min Rds On): | 4.5V, 10V |
Current - Continuous Drain (Id) @ 25°C: | 20A (Ta) |
Drain to Source Voltage (Vdss): | 30V |
Technology: | MOSFET (Metal Oxide) |
FET Type: | P-Channel |
Part Status: | Active |
Packaging: | Tape & Reel (TR) |
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The FDS6681Z is a N-Channel MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with a given Polarity class R, T, and F label. The FET versions of MOSFETs are manufactured in different levels of power capabilities and include a wide range of usage. In this article, the applications and principles of the FDS6681Z will be discussed.
FDS6681Z Application Fields
The FDS6681Z is most commonly used in high-voltage switching in power circuits and high power applications. This MOSFET is designed to offer very low channel resistance which is a must for high-power applications. Additionally, the device can handle high current and the integral reverse body diode simplifies the design of protection circuits. This MOSFET is commonly used in applications such as:
- DC/DC converters
- UPS/AVR systems
- industrial motor control systems
- voltage regulators
- motor drives
- DC-DC boosters
- electronic lamp ballasts
- LCD TVs
- LED drivers
FDS6681Z Working Principle
The FDS6681Z operates through the use of a gate voltage that can control the state of the transistor. The gate voltage is applied between the gate-source region of the transistor, which changes the current flow between the drain and the source. Applying a positive voltage to the gate will cause electrons to accumulate near the gate-source junction, forming an inversion layer, which can allow current flow between the drain and the source. If a negative voltage is applied, the electrons will deplete the inversion layer and no current will flow. This is known as the principle of operation of the MOSFET.
In practical applications, the FDS6681Z features two structures consisting of the gate and drain, the drain being connected to the source and the gate being connected to the source. A voltage can then be applied to the gate for controlling the current flow into the drain. For example, a positive voltage gate is used for high current applications to turn the transistor on or off. Similarly, for low current applications, a negative gate voltage is used.
Typically, to enhance the performance and reduce power consumption, the FDS6681Z is designed with a low RDS(on) (drain-to-source resistance) and low gate charge (Qg), which refer to the resistance which exists between the drain and the source of the MOSFET and the time delay between the application of a gate voltage and the desired current flow
The FDS6681Z offers a wide range of application possibilities within high-power circuits, including direct current (DC) motor drives, switching power supplies, UPS systems, and industrial motor control systems. It is also suitable for clean and efficient power regulation as it offers excellent linearity, high efficiency, and low switching losses.
The specific data is subject to PDF, and the above content is for reference
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