IXFH42N50P2 Allicdata Electronics
Allicdata Part #:

IXFH42N50P2-ND

Manufacturer Part#:

IXFH42N50P2

Price: $ 5.34
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: MOSFET N-CH 500V 42A TO247
More Detail: N-Channel 500V 42A (Tc) 830W (Tc) Through Hole TO-...
DataSheet: IXFH42N50P2 datasheetIXFH42N50P2 Datasheet/PDF
Quantity: 1985
1 +: $ 4.85730
30 +: $ 3.98034
120 +: $ 3.59205
510 +: $ 3.00957
1020 +: $ 2.62124
Stock 1985Can Ship Immediately
$ 5.34
Specifications
Vgs(th) (Max) @ Id: 4.5V @ 4mA
Package / Case: TO-247-3
Supplier Device Package: TO-247AD (IXFH)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 830W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 5300pF @ 25V
Vgs (Max): ±30V
Gate Charge (Qg) (Max) @ Vgs: 92nC @ 10V
Series: HiPerFET™, PolarHV™
Rds On (Max) @ Id, Vgs: 145 mOhm @ 500mA, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Drain to Source Voltage (Vdss): 500V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tube 
Description

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The IXFH42N50P2 is a vertical power MOSFET developed by IXYS Corporation, designed to optimize gate and avalanche energy performance resulting in high efficiency. This transistor type is capable of providing higher breakdown voltage, faster switching, and improved surge and thermal performance. As a single MOSFET, the IXFH42N50P2 is commonly used in a number of applications including power switching, voltage regulation, and motor control.

Operation Principle

The IXFH42N50P2 operates according to the basic MOSFET principles. In the MOSFET silicon die, electrons flow between the source and drain through an inversion layer located between them. The size of the inversion layer is determined by the gate bias, which is the potential difference between the gate and the source. When a positive potential is applied to the gate, a large number of electrons flow into the inversion layer, resulting in a large drain-source current.

Application Field

The IXFH42N50P2 power MOSFET is suitable for applications in which high efficiency and fast switching speeds are desired. Typical applications include motor controllers, power rectifiers, high-power linear regulators, and power factor correction circuits. It is also suitable for switching applications such as inverters, dc-dc converters, uninterruptible power supplies, and frequency converters. Additionally, the IXFH42N50P2 can be used in high-frequency switching regulators, line load regulation, and high-efficiency power converters..

The IXFH42N50P2 can also be used in lighting applications. Due to its high power handling capability, it is a suitable candidate for use in high bay lighting, street lights, irrigation systems, and other outdoor applications. Other potential applications include automotive electronics, medical equipment, and audio-visual systems.

Advantages

The IXFH42N50P2 offers a number of advantages compared to other MOSFETs. It features a low resistance, fast switching speeds, high power handling capability, and an operating voltage range of up to 500V. It also offers a wide temperature range, and the package design reduces power losses and improves device cooling.

The IXFH42N50P2 has a superior avalanche energy performance and improved robustness compared to other products, helping to reduce system power losses. The package is also suitable for easy optimization of circuit designs, as it provides a good balance between thermal and electrical performance. At the same time, the IXFH42N50P2 can be combined with other semiconductor devices in a single package.

Conclusion

The IXFH42N50P2 is a single power MOSFET developed by IXYS Corporation for applications requiring high efficiency. It offers fast switching speeds, a wide temperature range, and superior avalanche energy performance, making it suitable for a wide range of applications such as motor controllers, power rectifiers, high-power linear regulators, and power factor correction circuits. Additionally, the package design reduces power losses and improves device cooling.

The specific data is subject to PDF, and the above content is for reference

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