Allicdata Part #: | IXTT26N50P-ND |
Manufacturer Part#: |
IXTT26N50P |
Price: | $ 4.24 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | IXYS |
Short Description: | MOSFET N-CH 500V 26A TO-268 |
More Detail: | N-Channel 500V 26A (Tc) 400W (Tc) Surface Mount TO... |
DataSheet: | IXTT26N50P Datasheet/PDF |
Quantity: | 1000 |
30 +: | $ 3.81696 |
Vgs(th) (Max) @ Id: | 5.5V @ 250µA |
Package / Case: | TO-268-3, D³Pak (2 Leads + Tab), TO-268AA |
Supplier Device Package: | TO-268 |
Mounting Type: | Surface Mount |
Operating Temperature: | -55°C ~ 150°C (TJ) |
Power Dissipation (Max): | 400W (Tc) |
FET Feature: | -- |
Input Capacitance (Ciss) (Max) @ Vds: | 3600pF @ 25V |
Vgs (Max): | ±30V |
Gate Charge (Qg) (Max) @ Vgs: | 65nC @ 10V |
Series: | PolarHV™ |
Rds On (Max) @ Id, Vgs: | 230 mOhm @ 13A, 10V |
Drive Voltage (Max Rds On, Min Rds On): | 10V |
Current - Continuous Drain (Id) @ 25°C: | 26A (Tc) |
Drain to Source Voltage (Vdss): | 500V |
Technology: | MOSFET (Metal Oxide) |
FET Type: | N-Channel |
Part Status: | Active |
Packaging: | Tube |
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The IXTT26N50P is a type of Power MOSFET (PMOS) designed for medium to high power switching applications. It is part of a family of MOSFETs which optimize RDS(on) with minimum area. The IXTT26N50P features an advanced Terminator Technology N-Channel MOSFET process, allowing it to function with fast switching speeds, improved immunity to noise and better thermal characteristics. This makes it an ideal choice for compact and high switching performance requirements.
The IXTT26N50P is mainly used in power electronics circuits as a switch, or sometimes as an amplifier. These applications include switch mode power supplies, DC-DC converters, UPS, welding and variousAC/DC converters. This MOSFET is able to handle voltages up to 500 volts and continuous currents up to 40 amps, with a maximum peak current rating of 121 amps.
The IXTT26N50P, like all MOSFETs, operates using a Gate to Source voltage (VGS) to control the flow of electricity from the drain to source terminals. The drain and source terminals are separated by a thin oxide insulator which allows a voltage signal applied to the Gate to interact with the electrical current already flowing between the drain and source, thereby allowing it to be controlled and manipulated. When the gate voltage is higher than the source, the MOSFET will act as an open switch, allowing current to flow. When the gate voltage is lower than the source, the MOSFET will act like a closed switch, preventing current from flowing.
The IXTT26N50P features low gate charge (Qg) and low gate-source capacitance (Ciss). This allows the MOSFET to switch at high speeds and with greater efficiency than other power MOSFETs. It also has a low threshold voltage (VGSth) of 2.8V, meaning it requires less Gate-to-Source voltage to be switched between the ON and OFF states. In addition, the IXTT26N50P has a low on-resistance (RDS(on)) which results in lower power dissipation, reduced heat generation and increased efficiency in applications.
The IXTT26N50P can be used in a range of electrical applications, from consumer products to automotive electronics, telecommunications, and industrial equipment. Its features make it an ideal choice for any medium to high power switching application, where high efficiency and fast response are required.
In summary, the IXTT26N50P Power MOSFET is an ideal choice for medium to high power switching applications due to its advanced Terminator Technology process, low gate charge and low gate-source capacitance, low threshold voltage and low on-resistance. This makes it suitable for a broad range of applications, from consumer electronics to automotive and industrial equipment.
The specific data is subject to PDF, and the above content is for reference
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